SEMICON Taiwan 2025 is officially launched, the silicon photonics and heterogeneous integration forum is eye-catching, and the international CEO summit will be on the scene

The annual global semiconductor conference SEMICON Taiwan 2025 officially begins this week. This year, the exhibition scale reached a new high, integrating more than 1,200 manufacturers and crews to more than 4,000 booths, attracting the global semiconductor industry chain.

Today's focus forum is overwhelming

The most popular "Silicon Photonic International Forum" on the first day of its opening has been fully exploded, showing the market's high attention to optical and electrical integration and high-speed computing applications. The three-day "International Peak Forum for Integration of Extraordinary Quality" is also expected to focus on cutting-edge technologies such as Chiplet, CPO, silicon photonic optical engine, advanced substrates and testing solutions, and explore HPC, HBM, thermal solutions and GaN car packaging to comprehensively analyze the supply chain ecology and technical challenges under AI and high-speed computing.

Master Forum Weight Level Spokesperson

The "Master Forum" held on Wednesday will welcome industry leaders such as Sun and Moonlight Semiconductor Executive Director and SEMI Global Board Executive Committee Chairman Wu Tianyu, Chairman of the Taiwan Semiconductor Association, Vice President and Deputy Co-operation Leader of Taiwan Electric Power and Information Security Director Hou Yongqing, etc., to jointly explore the challenges and future layout of the global semiconductor supply chain.

At the same time, the international peak forum for the integration of the international quality gathers international weight lecturers, including Jan Vardaman, president of TechSearch International (analyzing the trends of AI packaging market), AMD Fellow Daniel Ng (discussing how advanced packaging can promote AI hardware development), and Nandish Mehta, senior research scientist at NVIDIA (focusing on optical integration Co-Integrated Optics technology), as well as Taiwan Electric's representatives, show the high attention of global industry research to next-generation semiconductors.

Full display of special areas and international museums

This exhibition has specially established five major technical areas, fully presenting the latest developments in semiconductor processes and new applications:

3DIC Advanced Packaging Area Semiconductor packaging area Width energy gap power semiconductor area Panel-level fan-out packaging area (FOPLP) Silicon Photonic Area

In addition, a national museum area is also set up at the venue, with more than 17 countries and regions participating in the first group exhibition, showing the high level of Taiwan's semiconductor and international linkage.