The demand for power consumption and heat dissipation of AI chips is increasing, and the innovation and flexible layout of technology have been upgraded from iron leather factories to automatic equipment factories, and continue to expand new opportunities in the field of advanced packaging and testing.
When the computing efficiency of AI chips continues to improve, the heat energy and power consumption will inevitably increase rapidly. How to properly implant heat dissipation chips on the chips has become the focus of advanced packaging processes. The supply of 70% of the thermal film process automatic equipment in the market is a company located in Kaohsiung with a capital of less than 300 million yuan, Wangten Technology.
Insight into the pain points of sealing the creative technology Flexible posture stands on the marketThe process of heat dissipation sheets is to fix the wafer on the substrate, then apply heat dissipation paste and fixing rubber evenly, and finally apply pressure to make the wafer and heat dissipation sheets tightly, just like putting fruit sauce on the toast (wafer) and putting another layer of toast (heat dissipation sheets) to make a heat-pressing sandwich. In the semiconductor process, the "swappable" and "pressure" processes all rely on the machine equipment; if any errors or offsets occur during the process, resulting in poor matching of chips and heat dissipation chips, it will affect the chip yield, which is a key post-process with high accuracy requirements.
Founded in 1994 and turned into a counter on the 26th, Yuen has been an automated equipment factory in the field of the world for more than 20 years. It includes Taiwan Electric Power, Sun and Moonlight Projection Control, and other two-strait sealing and testing factories such as Licheng and Jiang Su Chang Electric. They have purchased equipment from Yuen. "Seven of the top ten sealing and testing factories in the world are our customers," said Xu Jiaxin, General Manager of Yuen when accepting the "Today's Weekly".
The starting point of the heat dissipation device Longtou is a Kaohsiung iron leather factory.
Xu Jiaxin recalled that he and his colleague Wang Yuqin, 27 years old, who was an engineer at the closure testing factory Huatai, met Wang Huiwan, an agent for automatic equipment parts. The three of them were optimistic about the prospects of the equipment industry. They created an automatic equipment factory for two million yuan, and locked up the semiconductor with high capital expenditures. "That was a light period without much burden. We want to come out and watch!" he said.
Shortly after its establishment, the company was willing to gain a foothold in the semiconductor industry. At that time, the pin (Pin) of the IC was responsible for transmitting the signal, and the test factory was often deformed due to impact, which caused the test factory to be unable to test the chip performance. International equipment manufacturers and local industries were reluctant to do so. Later, Fulei Electronics, a Kaohsiung test factory, came to Fengli, who was a freshman.
Under the leadership of technical director Wang Yuqin, Wang Yan developed equipment that effectively reduces the impact force of IC, successfully cut orders, and entered the Sun and Moonlight and silicon product supply chain that were troubled by the impact problem.
Because the team was born into a testing factory, Yu Teng was able to fully understand the pain points of customers and constantly developed products that meet market demand. For example, more than 20 years ago, the glue and heat dissipation flakes were still supplied by Japanese and Korean manufacturers. Yu Teng cooperated with Sun and Moonlight to develop a "one dragon equipment" that can integrate related processes.
Xu Jiaxin explained that the main difficulty of clicking on the "one-piece machine" of glue and implant lies in how to accurately "paint" the heat dissipation. The special solution designed by Wang Yuchen can solve environmental interference and adhesive problems and improve automation accuracy.
Due to customers' requirements for cost and development speed, Hunting also mods various equipment, such as glue modules, feed modules, etc., allowing the company to quickly change design, assembly and deliver in a short time.